Terahertz-Light Field Camera Prototyp
![[Translate to English:] Terahertz Lichtfeld Kamera Prototyp](/fileadmin/_processed_/d/5/csm_THz-LFI-Prototype_99b5c8d307.jpg "[Translate to English:] Terahertz Lichtfeld Kamera Prototyp")
![[Translate to English:] Terahertz Lichtfeld Kamera Prototyp Seitenansicht](/fileadmin/_processed_/4/f/csm_THz-LFI-sideview_c1f112f395.jpg "[Translate to English:] Terahertz Lichtfeld Kamera Prototyp Seitenansicht")
Light-field has traditionally been a domain of visible light computational imaging. Our chair is leading the development of light-field methodologies for the THz spectrum, bringing new foundational understanding and hardware capabilities for bridging the terahertz gap.
Currently, we are building the first ever THz light-field camera prototype - which consists of a 3x3 super-array of lens coupled 1k-pixel THz CMOS cameras - in a single package. The CMOS camera chip is presented in the International Solid-State Circuits Conference (ISSCC) 2021. The figure shows the prototype of the light field array. The prototype serves as the hardware platform for the development of light-field based real-time THz 3-D imaging techniques.
- 2019
2672.
Pomp, André; Poth, Lucian; Kraus, Vadim; Meisen, Tobias
Enhancing Knowledge Graphs with Data Representatives
Proceedings of the 21st International Conference on Enterprise Information Systems, Page 49—60
Publisher: SCITEPRESS - Science and Technology Publications
2019ISBN: 978-989-758-372-8
2671.
Samsonov, Vladimir; Lipp, Johannes; Noodt, Philipp; Fenollar Solvay, Alexia; Meisen, Tobias
More Machine Learning for Less: Comparing Data Generation Strategies in Mechanical Engineering and Manufacturing
Proceedings of the 2019 IEEE Symposium Series on Computational Intelligence (SSCI 2019)
Publisher: IEEE
20192670.
Samsonov, Vladimir; Lipp, Johannes; Noodt, Philipp; Fenollar Solvay, Alexia; Meisen, Tobias
More Machine Learning for Less: Comparing Data Generation Strategies in Mechanical Engineering and Manufacturing
Proceedings of the 2019 IEEE Symposium Series on Computational Intelligence (SSCI 2019)
Publisher: IEEE
20192669.
Samsonov, Vladimir; Lipp, Johannes; Noodt, Philipp; Fenollar Solvay, Alexia; Meisen, Tobias
More Machine Learning for Less: Comparing Data Generation Strategies in Mechanical Engineering and Manufacturing
Proceedings of the 2019 IEEE Symposium Series on Computational Intelligence (SSCI 2019)
Publisher: IEEE
20192668.
Samsonov, Vladimir; Lipp, Johannes; Noodt, Philipp; Fenollar Solvay, Alexia; Meisen, Tobias
More Machine Learning for Less: Comparing Data Generation Strategies in Mechanical Engineering and Manufacturing
Proceedings of the 2019 IEEE Symposium Series on Computational Intelligence (SSCI 2019)
Publisher: IEEE
20192667.
Samsonov, Vladimir; Lipp, Johannes; Noodt, Philipp; Fenollar Solvay, Alexia; Meisen, Tobias
More Machine Learning for Less: Comparing Data Generation Strategies in Mechanical Engineering and Manufacturing
Proceedings of the 2019 IEEE Symposium Series on Computational Intelligence (SSCI 2019)
Publisher: IEEE
20192666.
Alsayegh, M.; Schmuelling, B.; Clemens, M.
Misalignment Influence on Resonance Shielding in Wireless Power Transfer for Electric Vehicles
2019 IEEE Wireless Power Transfer Conference (IEEE WPTC'2019), London, UK, 17.-23.06.2019. Digest paper, submitted
20192665.
Platte, Laura; Schönefeld, Kathrin; Hees, Frank
Künstliche Intelligenz in der Produktionstechnik - eine Kränkung des Ingenieurs?
Ferrum : Nachrichten aus der Eisenbibliothek, Stiftung der Georg (91) :94—101
20192664.
Haberstroh, Max C.; Sauer, Julia; Pomp, André; Kirmse, Andreas; Meisen, Tobias; Hees, Frank; Jeschke, Sabina
Method to Create a VR Event by Evaluating Third Party Information and Re-Providing the Processed Information in Real-Time
(United States Patent Application 20190213423)
20192663.
Haberstroh, Max C.; Sauer, Julia; Pomp, André; Kirmse, Andreas; Meisen, Tobias; Hees, Frank; Jeschke, Sabina
Method to Create a VR Event by Evaluating Third Party Information and Re-Providing the Processed Information in Real-Time
(United States Patent Application 20190213423)
20192662.
Haberstroh, Max C.; Sauer, Julia; Pomp, André; Kirmse, Andreas; Meisen, Tobias; Hees, Frank; Jeschke, Sabina
Method to Create a VR Event by Evaluating Third Party Information and Re-Providing the Processed Information in Real-Time
(United States Patent Application 20190213423)
20192661.
Haberstroh, Max C.; Sauer, Julia; Pomp, André; Kirmse, Andreas; Meisen, Tobias; Hees, Frank; Jeschke, Sabina
Method to Create a VR Event by Evaluating Third Party Information and Re-Providing the Processed Information in Real-Time
(United States Patent Application 20190213423)
20192660.
Haberstroh, Max C.; Sauer, Julia; Pomp, André; Kirmse, Andreas; Meisen, Tobias; Hees, Frank; Jeschke, Sabina
Method to Create a VR Event by Evaluating Third Party Information and Re-Providing the Processed Information in Real-Time
(United States Patent Application 20190213423)
20192659.
Vosen, Mirco
Machbarkeitsstudie zu verschiedenen Ansätzen statischer Zuladungserkennung bei Gelenkbussen für die Präzisierung der Reichweitenprädiktion
Master-Thesis
January 20192658.
Kolonko, L.; Velten, J.; Kummert, A.
Live Demonstration: A Raspberry Pi Based Video Pipeline for 2-D Wave Digital Filters on Low-Cost FPGA Hardware
2019 IEEE International Symposium on Circuits and Systems (ISCAS), Page 1-1
20192657.
Kratz, Sascha; Hanses, Paul; Krüger, Benjamin; Wegener, Ralf; Soter, Stefan
Integration of Second Life Batteries into a Smart Overhead Contact System based on SiC-Technology
2019 IEEE Transportation Electrification Conference and Expo (ITEC), Page 1--5
2019ISBN: 2377-5483
2656.
Hees, Frank; Müller-Abdelrazeq, Sarah; Langer, Tristan; Voss, Michael; Schmitt, Robert; Huettemann, Guido; Rook-Weiler, Kerstin; Tracht, Kirsten; Herfs, Werner; Roggendorf, Simon; Heinen, Kurt; Kuhlenkötter, Bernd; Hypki, Alfred; Deuse, Jochen; Höptner, Gabriele; Ortmann, Sebastian; Bobe, Ulrich; Schulze, Robin; Zimmermann, André; Göppert, Amon
Kompetenz Montage - Kollaborativ und Wandlungsfähig
2019ISBN: 978-3-948169-06-0
2655.
Information
Publisher: MDPI
20192654.
Horn, Gesa; Klanten, Christoph; Mamonova, Swetlana; Schönefeld, Kathrin; Simons, Leonard; Seidel, Lisa; Uelpenich, Jérome
Forecasting Aachen 2030 – Urbane Produktion in der Zukunftsstadt
MIA Expertisen
20192653.
Jungnickel, Robert; Pomp, André; Kirmse, Andreas; LI, Xiang; Samsonov, Vladimir; Meisen, Tobias
Evaluation and Comparison of Cross-lingual Text Processing Pipelines
2019 IEEE Symposium Series on Computational Intelligence (SSCI), Page 417—425
20192652.
Jungnickel, Robert; Pomp, André; Kirmse, Andreas; LI, Xiang; Samsonov, Vladimir; Meisen, Tobias
Evaluation and Comparison of Cross-lingual Text Processing Pipelines
2019 IEEE Symposium Series on Computational Intelligence (SSCI), Page 417—425
20192651.
Jungnickel, Robert; Pomp, André; Kirmse, Andreas; LI, Xiang; Samsonov, Vladimir; Meisen, Tobias
Evaluation and Comparison of Cross-lingual Text Processing Pipelines
2019 IEEE Symposium Series on Computational Intelligence (SSCI), Page 417—425
20192650.
Jungnickel, Robert; Pomp, André; Kirmse, Andreas; LI, Xiang; Samsonov, Vladimir; Meisen, Tobias
Evaluation and Comparison of Cross-lingual Text Processing Pipelines
2019 IEEE Symposium Series on Computational Intelligence (SSCI), Page 417—425
20192649.
Jungnickel, Robert; Pomp, André; Kirmse, Andreas; LI, Xiang; Samsonov, Vladimir; Meisen, Tobias
Evaluation and Comparison of Cross-lingual Text Processing Pipelines
2019 IEEE Symposium Series on Computational Intelligence (SSCI), Page 417—425
20192648.
Cao, J.; Zhu, J.; Hu, W.; Kummert, A.
Epileptic Signal Classification with Deep EEG Features by Stacked CNNs
IEEE Transactions on Cognitive and Developmental Systems :1
2019
ISSN: 2379-8920
