Terahertz-Light Field Camera Prototyp
![[Translate to English:] Terahertz Lichtfeld Kamera Prototyp](/fileadmin/_processed_/d/5/csm_THz-LFI-Prototype_99b5c8d307.jpg "[Translate to English:] Terahertz Lichtfeld Kamera Prototyp")
![[Translate to English:] Terahertz Lichtfeld Kamera Prototyp Seitenansicht](/fileadmin/_processed_/4/f/csm_THz-LFI-sideview_c1f112f395.jpg "[Translate to English:] Terahertz Lichtfeld Kamera Prototyp Seitenansicht")
Light-field has traditionally been a domain of visible light computational imaging. Our chair is leading the development of light-field methodologies for the THz spectrum, bringing new foundational understanding and hardware capabilities for bridging the terahertz gap.
Currently, we are building the first ever THz light-field camera prototype - which consists of a 3x3 super-array of lens coupled 1k-pixel THz CMOS cameras - in a single package. The CMOS camera chip is presented in the International Solid-State Circuits Conference (ISSCC) 2021. The figure shows the prototype of the light field array. The prototype serves as the hardware platform for the development of light-field based real-time THz 3-D imaging techniques.
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Hoffmann, Max; Plumanns, Lana; Lenz, Laura; Schuster, Katharina; Meisen, Tobias; Jeschke, Sabina
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Hoffmann, Max; Plumanns, Lana; Lenz, Laura; Schuster, Katharina; Meisen, Tobias; Jeschke, Sabina
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Lüdtke, Daniel; Tutsch, Dietmar
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Lüdtke, Daniel; Tutsch, Dietmar
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August 20162063.
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Potthoff, Nils; Gremzow, Carsten; Brandau, Christoph; Tutsch, Dietmar
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Potthoff, Nils; Gremzow, Carsten; Brandau, Christoph; Tutsch, Dietmar
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Proceedings of the IEEE International Conference on Consumer Electronics (ICCE 2016), Las Vegas, USA, Page 208--209
January 20162060.
Potthoff, Nils; Gremzow, Carsten; Brandau, Christoph; Tutsch, Dietmar
A New Approach to Mapping Software to Coprocessor Circuits
Proceedings of the IEEE International Conference on Consumer Electronics (ICCE 2016), Las Vegas, USA, Page 208--209
January 20162059.
Potthoff, Nils; Gremzow, Carsten; Brandau, Christoph; Tutsch, Dietmar
A New Approach to Mapping Software to Coprocessor Circuits
Proceedings of the IEEE International Conference on Consumer Electronics (ICCE 2016), Las Vegas, USA, Page 208--209
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Holtz, J.
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Ou, Jifei; Skouras, Mélina; Vlavianos, Nikolaos; Heibeck, Felix; Cheng, Chin-Yi; Peters, Jannik; Ishii, Hiroshi
AeroMorph - Heat-Sealing Inflatable Shape-Change Materials for Interaction Design
Proceedings of the 29th Annual Symposium on User Interface Software and TechnologyfromUIST '16, Page 121—132
Publisher: Association for Computing Machinery, New York, NY, USA
20162056.
Ou, Jifei; Skouras, Mélina; Vlavianos, Nikolaos; Heibeck, Felix; Cheng, Chin-Yi; Peters, Jannik; Ishii, Hiroshi
AeroMorph - Heat-Sealing Inflatable Shape-Change Materials for Interaction Design
Proceedings of the 29th Annual Symposium on User Interface Software and TechnologyfromUIST ’16, Page 121—132
Publisher: Association for Computing Machinery, New York, NY, USA
20162055.
Hoffmann, Max; Thomas, Philipp; Schütz, Daniel; Vogel-Heuser, Birgit; Meisen, Tobias; Jeschke, Sabina
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7th ACM/IEEE International Conference on Cyber-Physical Systems
20162054.
Ou, Jifei; Skouras, Mélina; Vlavianos, Nikolaos; Heibeck, Felix; Cheng, Chin-Yi; Peters, Jannik; Ishii, Hiroshi
AeroMorph - Heat-Sealing Inflatable Shape-Change Materials for Interaction Design
Proceedings of the 29th Annual Symposium on User Interface Software and TechnologyfromUIST '16, Page 121—132
Publisher: Association for Computing Machinery, New York, NY, USA
20162053.
Ou, Jifei; Skouras, Mélina; Vlavianos, Nikolaos; Heibeck, Felix; Cheng, Chin-Yi; Peters, Jannik; Ishii, Hiroshi
AeroMorph - Heat-Sealing Inflatable Shape-Change Materials for Interaction Design
Proceedings of the 29th Annual Symposium on User Interface Software and TechnologyfromUIST '16, Page 121—132
Publisher: Association for Computing Machinery, New York, NY, USA
20162052.
Rix, Michael; Kujat, Bernd; Meisen, Tobias; Jeschke, Sabina
An Agile Information Processing Framework for High Pressure Die Casting Applications in Modern Manufacturing Systems
Procedia CIRP, 41 :1084—1089
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ISSN: 221282712051.
Rix, Michael; Kujat, Bernd; Meisen, Tobias; Jeschke, Sabina
An Agile Information Processing Framework for High Pressure Die Casting Applications in Modern Manufacturing Systems
Procedia CIRP, 41 :1084—1089
2016
ISSN: 221282712050.
Rix, Michael; Kujat, Bernd; Meisen, Tobias; Jeschke, Sabina
An Agile Information Processing Framework for High Pressure Die Casting Applications in Modern Manufacturing Systems
Procedia CIRP, 41 :1084—1089
2016
ISSN: 221282712049.
Rix, Michael; Kujat, Bernd; Meisen, Tobias; Jeschke, Sabina
An Agile Information Processing Framework for High Pressure Die Casting Applications in Modern Manufacturing Systems
Procedia CIRP, 41 :1084—1089
2016
ISSN: 221282712048.
Rix, Michael; Kujat, Bernd; Meisen, Tobias; Jeschke, Sabina
An Agile Information Processing Framework for High Pressure Die Casting Applications in Modern Manufacturing Systems
Procedia CIRP, 41 :1084—1089
2016
ISSN: 22128271
