Chip assembly technology, microsystems technology and assembly laboratory

In this laboratory, there are all necessary machines to perform packaging and assembly of the designed circuits.

The equipment includes:

  • Flip chip bonder - used for precise bonding of different elements with heat and pressure
  • Wire bonding machine – used for establishing electrical connections between the chip and the board
  • Soldering station
  • Microscope station - for precise packaging of chips and lenses.

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