Chip assembly technology, microsystems technology and assembly laboratory
![Bonding at IHCT](/fileadmin/_processed_/2/2/csm_Bonder1_IHCT_420ae82978.png)
![Wafer processing Runder Wafer eines Designs](/fileadmin/_processed_/3/6/csm_Wafer2_IHCT_8e22a90c4d.png)
In this laboratory, there are all necessary machines to perform packaging and assembly of the designed circuits.
The equipment includes:
- Flip chip bonder - used for precise bonding of different elements with heat and pressure
- Wire bonding machine – used for establishing electrical connections between the chip and the board
- Soldering station
- Microscope station - for precise packaging of chips and lenses.