Terahertz-Light Field Camera Prototyp

18.02.2021|10:00 Uhr

Terahertz-Light Field Camera Prototyp

Light-field cameras record both the brightness and direction of the incident light rays. This spatiodirectional information can be post-processed for a dynamic focal point adjustment and 3-D imaging.

Light-field has traditionally been a domain of visible light computational imaging. Our chair is leading the development of light-field methodologies for the THz spectrum, bringing new foundational understanding and hardware capabilities for bridging the terahertz gap.

Currently, we are building the first ever THz light-field camera prototype - which consists of a 3x3 super-array of lens coupled 1k-pixel THz CMOS cameras - in a single package. The CMOS camera chip is presented in the International Solid-State Circuits Conference (ISSCC) 2021. The figure shows the prototype of the light field array. The prototype serves as the hardware platform for the development of light-field based real-time THz 3-D imaging techniques.

Preliminary work



2012

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Meisen, Tobias
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from Fortschritt-Berichte VDI. Reihe 10: Informatik / Kommunikation; 823
Publisher: VDI Verlag
2012

ISBN: 978-3-18-382310-9

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Meisen, Tobias
Framework zur Kopplung numerischer Simulationen für die Fertigung von Stahlerzeugnissen
from Fortschritt-Berichte VDI. Reihe 10: Informatik / Kommunikation; 823
Publisher: VDI Verlag
2012

ISBN: 978-3-18-382310-9

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Meisen, Tobias
Framework zur Kopplung numerischer Simulationen für die Fertigung von Stahlerzeugnissen
from Fortschritt-Berichte VDI. Reihe 10: Informatik / Kommunikation; 823
Publisher: VDI Verlag
2012

ISBN: 978-3-18-382310-9

1461.

Lora Girón, Mónica Alejandra; Paulus, Alexander; Bitsch Link, Jó Ágila; Wehrle, Klaus
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Proceedings of the Third ACM International Workshop on Mobile Opportunistic NetworksfromMobiOpp '12, Page 87—88
Publisher: ACM, New York, NY, USA
2012

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Lora Girón, Mónica Alejandra; Paulus, Alexander; Bitsch Link, Jó Ágila; Wehrle, Klaus
Gossipmule: Scanning and Disseminating Information Between Stations in Cooperative WLANs
Proceedings of the Third ACM International Workshop on Mobile Opportunistic NetworksfromMobiOpp ’12, Page 87—88
Publisher: ACM, New York, NY, USA
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Lora Girón, Mónica Alejandra; Paulus, Alexander; Bitsch Link, Jó Ágila; Wehrle, Klaus
Gossipmule: Scanning and Disseminating Information Between Stations in Cooperative WLANs
Proceedings of the Third ACM International Workshop on Mobile Opportunistic NetworksfromMobiOpp '12, Page 87—88
Publisher: ACM, New York, NY, USA
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Lora Girón, Mónica Alejandra; Paulus, Alexander; Bitsch Link, Jó Ágila; Wehrle, Klaus
Gossipmule: Scanning and Disseminating Information Between Stations in Cooperative WLANs
Proceedings of the Third ACM International Workshop on Mobile Opportunistic NetworksfromMobiOpp '12, Page 87—88
Publisher: ACM, New York, NY, USA
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Lora Girón, Mónica Alejandra; Paulus, Alexander; Bitsch Link, Jó Ágila; Wehrle, Klaus
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Proceedings of the Third ACM International Workshop on Mobile Opportunistic NetworksfromMobiOpp ’12, Page 87—88
Publisher: ACM, New York, NY, USA
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Callou, Gustavo; Maciel, Paulo; Tutsch, Dietmar; Araújo, Julian
Models for Dependability and Sustainability Analysis of Data Center Cooling Architectures
Proceedings of the Second International Workshop on Dependability of Clouds, Data Centers and Virtual Machine Technology (DCDV 2012); Boston
Publisher: IEEE
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Callou, Gustavo; Maciel, Paulo; Tutsch, Dietmar
Models for Dependability and Sustainability Analysis of Data Center Cooling Architectures
Proceedings of the Second International Workshop on Dependability of Clouds, Data Centers and Virtual Machine Technology (DCDV 2012); Boston
Publisher: IEEE
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Callou, Gustavo; Maciel, Paulo; Tutsch, Dietmar; Araújo, Julian
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Proceedings of the Second International Workshop on Dependability of Clouds, Data Centers and Virtual Machine Technology (DCDV 2012); Boston
Publisher: IEEE
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ISBN: 978-953-51-0700-2

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Publisher: IEEE
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from MobiOpp '12
Publisher: ACM, New York, NY, USA
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ISBN: 978-1-4503-1208-0

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from MobiOpp '12
Publisher: ACM, New York, NY, USA
2012

ISBN: 978-1-4503-1208-0

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Proceedings of the Third ACM International Workshop on Mobile Opportunistic Networks
from MobiOpp '12
Publisher: ACM, New York, NY, USA
2012

ISBN: 978-1-4503-1208-0

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Logvinenko, Alexander; Tutsch, Dietmar
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Proceedings of the 26th European Simulation and Modelling Conference (ESM 2012); Essen, Page 144--151
Publisher: Eurosis
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Logvinenko, Alexander; Tutsch, Dietmar
RECSIM - A Simulator for reconfigurable Network-on-Chip Topologies
Proceedings of the 26th European Simulation and Modelling Conference (ESM 2012); Essen, Page 144--151
Publisher: Eurosis
October 2012

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Logvinenko, Alexander; Tutsch, Dietmar
RECSIM - A Simulator for reconfigurable Network-on-Chip Topologies
Proceedings of the 26th European Simulation and Modelling Conference (ESM 2012); Essen, Page 144--151
Publisher: Eurosis
2012