Terahertz-Light Field Camera Prototyp
Light-field has traditionally been a domain of visible light computational imaging. Our chair is leading the development of light-field methodologies for the THz spectrum, bringing new foundational understanding and hardware capabilities for bridging the terahertz gap.
Currently, we are building the first ever THz light-field camera prototype - which consists of a 3x3 super-array of lens coupled 1k-pixel THz CMOS cameras - in a single package. The CMOS camera chip is presented in the International Solid-State Circuits Conference (ISSCC) 2021. The figure shows the prototype of the light field array. The prototype serves as the hardware platform for the development of light-field based real-time THz 3-D imaging techniques.
Preliminary work
- 2013
1540.
Cimen, S. G.; Schmuelling, B.
Induktive Ladesysteme - Eine barrierefreie Alternative zu Kabel und Stecker
Neue Mobilität - Das Magazin vom Bundesverband eMobilität, Nr. 11,SS. 76
April 20131539.
Schmitz, J.; Camp, M.; Jung, M.; Runke, S.; Hansen, V.; Streckert, J.; Clemens, M.
Strategies for the Improvement of Critical Infrastructure Resilience to Electromagnetic Attacks - A (not too) Short Introduction
8th Security Research Conference "Future Security 2013", 17.-19.09.2013, Berlin, Germany., Proceedings :494-495
April 20131538.
Pfeiffer, Ullrich
Tutorial: THz Imaging with Silicon-based Circuits
OTST 2013 ***International Workshop on Optical Terahertz Science and Technology 2013,
OTST 2013 ***International Workshop on Optical Terahertz Science and Technology 2013
Kyoto Terrsa
April 20131537.
Hermwille, L.; Elsworth, R.; Fechtner, H.
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JIKO Policy Paper 04/2013
April 20131536.
Grzyb, J.; Zhao, Y.
Toward Room-Temperature All-Silicon Integrated THz Active Imaging
Antennas and Propagation (EuCAP), 2013 7th European Conference on, Date of Conference: 8-12 April 2013 :1740 - 1744 IEEE Conference Publications
April 20131535.
Fiedler, T.; Streckert, J.; Clemens, M.; Dickmann, S.
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Joint Meeting of The Bioelectromagnetics Society (BEMS) and the European BioElectromagnetics Association (EBEA) (BioEM 2013), Thessaloniki, Greece, 10.-14.06.2013., Abstract Collection :71-75(PA-53)
March 20131534.
Runke, S.; Hansen, V.; Streckert, J.; Clemens, M.
A Coupled Multi-Method Approach for the Numerical Simulation of Intentional Electromagnetic Interference into Critical Infrastructure
International Conference on Electromagnetics in Advanced Applications (ICEAA 2013), Torino, Italy, 09.-13.09.2013, Conf. Proceedings :875 – 879
March 2013
Publisher: IEEEISBN: 978-1-4673-5707-4
1533.
Baumanns, S.; Clemens, M.; Schöps, S.
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2013 International Symposium on Electromagnetic Theory (EMTS 2013), Hiroshima, Japan, 20.-24.05.2013
February 20131532.
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2012 ISSCC Jan Van Vessem Award for Outstanding European Paper
February 20131531.
Sherry, Hani; Grzyb, Janusz; Zhao, Yan; Al Hadi, Richard; Cathelin, Andreia; Kaiser, Andreas; Pfeiffer, Ullrich
A 1kpixel CMOS Camera Chip for 25fps Real-Time THz Imaging Applications
2012 Jan Van Vessem Award for Outstanding European Paper, ISSCC 2013, San Francisco, USA
February 20131530.
Kreibich, N.; Fechtner, H.
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February 20131528.
Schmuelling, B.; Cimen, S. G.; Vosshagen, T.; Turki, F.
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15th International Power Electronics and Motion Control Conference (EPE/PEMC 2012),
January 20131527.
Pfeiffer, Ullrich; Sarmah, Neelanjan
Silicon RF front end components for THz/sub-THz communication systems
13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems,
13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
Austin, Texas, USA
January 2013- 2013/2014
1526.
Beer, Thomas; Meisen, Tobias
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In Jeschke, Sabina and Isenhardt, Ingrid and Hees, Frank and Henning, Klaus, Editor, Automation, Communication and Cybernetics in Science and Engineering 2013/2014
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1525.
Logvinenko, Alexander; Gremzow, Carsten; Tutsch, Dietmar
RecMIN: a Reconfiguration Architecture for Network on Chip
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Publisher: IEEE
July 20131524.
Logvinenko, Alexander; Gremzow, Carsten; Tutsch, Dietmar
RecMIN: a Reconfiguration Architecture for Network on Chip
Proceedings of the 8th International Workshop on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC 2013); Darmstadt
Publisher: IEEE
July 2013- 2013/2014
1523.
Hoffmann, Max; Meisen, Tobias; Schilberg, Daniel; Jeschke, Sabina
Dynamische Optimierung der digitalen Produktentwicklung auf Basis cyber-physischer Monitoring-Systeme
In Jeschke, Sabina and Isenhardt, Ingrid and Hees, Frank and Henning, Klaus, Editor, Automation, Communication and Cybernetics in Science and Engineering 2013/2014
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20131521.
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RecMIN: a Reconfiguration Architecture for Network on Chip
Proceedings of the 8th International Workshop on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC 2013); Darmstadt
Publisher: IEEE
20131520.
Logvinenko, Alexander; Gremzow, Carsten; Tutsch, Dietmar
RecMIN: a Reconfiguration Architecture for Network on Chip
Proceedings of the 8th International Workshop on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC 2013); Darmstadt
Publisher: IEEE
July 20131519.
Sulikowski, Bartlomiej; Galkowski, Krzysztof; Kummert, Anton; Rogers, Eric
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of the IFAC International Workshop on Adaptation and Learning in Control and Signal Processing,, Page 689 - 694
Publisher: Caen, France
20131518.
Weiß, Mario
Electrothermal device-to-circuit interactions for half Thz SiGe:C HBT technologies
University of Wuppertal
20131517.
Krüger, Benjamin; Gruber, Sebastian; Soter, Stefan
Controlling of medium voltage power-factor of photovoltaic power plants from the low voltage side
2013 IEEE Energy Conversion Congress and Exposition, Page 569--574
2013ISBN: 2329-3748
- 2013/2014
1516.
Hoffmann, Max; Meisen, Tobias; Schilberg, Daniel; Jeschke, Sabina
A Modular Factory Planning Approach Based on Vertical Integration of the Information Flow
In Jeschke, Sabina and Isenhardt, Ingrid and Hees, Frank and Henning, Klaus, Editor, Automation, Communication and Cybernetics in Science and Engineering 2013/2014
Page 845—852
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845—852