Terahertz-Light Field Camera Prototyp

![[Translate to English:] Terahertz Lichtfeld Kamera Prototyp [Translate to English:] Terahertz Lichtfeld Kamera Prototyp](/fileadmin/_processed_/d/5/csm_THz-LFI-Prototype_99b5c8d307.jpg)
![[Translate to English:] Terahertz Lichtfeld Kamera Prototyp Seitenansicht [Translate to English:] Terahertz Lichtfeld Kamera Prototyp Seitenansicht](/fileadmin/_processed_/4/f/csm_THz-LFI-sideview_c1f112f395.jpg)
Light-field has traditionally been a domain of visible light computational imaging. Our chair is leading the development of light-field methodologies for the THz spectrum, bringing new foundational understanding and hardware capabilities for bridging the terahertz gap.
Currently, we are building the first ever THz light-field camera prototype - which consists of a 3x3 super-array of lens coupled 1k-pixel THz CMOS cameras - in a single package. The CMOS camera chip is presented in the International Solid-State Circuits Conference (ISSCC) 2021. The figure shows the prototype of the light field array. The prototype serves as the hardware platform for the development of light-field based real-time THz 3-D imaging techniques.
Preliminary work
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Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf; Jeschke, Sabina
Simulation and Interoperability in the Planning Phase of production processes
ASME 2011 International Mechanical Engineering Congress and Exposition :701—706
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Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf; Jeschke, Sabina
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ASME 2011 International Mechanical Engineering Congress and Exposition :701—706
20111301.
Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf; Jeschke, Sabina
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ASME 2011 International Mechanical Engineering Congress and Exposition :701—706
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ASME 2011 International Mechanical Engineering Congress and Exposition :701—706
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