German Research Foundation (DFG)
Großflächige THz-Detektoren Arrays basierend auf Dünnschicht-Transistor-Technologie (LATINO)
Priority Programme - SPP 2314
Support Code: DFG PF 661/21-1
Project Initiator:
Riedl, Thomas, Prof. Dr. rer. nat.
Chair of Electronic Devices
Bergische Universität Wuppertal
Neumaier, Daniel, Prof. Dr.
Chair of Smart Sensor Systems
Bergische Universität Wuppertal
Pfeiffer, Ullrich, Prof. Dr. rer. nat.
High Frequency Systems in Communications Technology / Terahertz-Technology, Automotive Radar Systems
Bergische Universität Wuppertal
Project Objectives:
THz imaging is an emerging field with main applications in non-destructive material analysis, biomedical applications, or security control. In the past 15 years, THz-cameras, capable of real-time imaging, have been developed using established Silicon CMOS or Silicon-Germanium BiCMOS technology. State-of-the-art Silicon CMOS THz cameras have 1024 pixels (32 x 32) on up to 10 x 10 mm2 large chips. Larger arrays with higher resolution are hardly accessible using conventional silicon technology because of high production costs, which scale directly with the die area. Furthermore, conventional rigid silicon technology does not allow constructing flexible focal plane arrays on curved surfaces reducing spherical aberrations, enlarging the field-of-view, and leading to a better off-axis resolution. We will develop flexible large area THz detector active matrix arrays using a backplane based on metal-oxide thin-film-transistor technology within the LATINO project. For THz detection, antenna coupled metal-insulator-graphene diodes will be used and optimized towards the specific requirements of the readout circuitry.
Dedicated low-noise amplifiers and multiplexer circuits will be designed and fabricated using metal-oxide semiconductors. The goal is to demonstrate an active pixel based on thin-film-technology comprising an antenna, a diode, and an amplifier at the end of the first funding phase. In the second phase, the technology will be transferred to flexible substrates. Additionally, an array with 64 x 64 pixels will be realized on a 4 x 4 cm2 area. This will lay the foundation for a new class of high-resolution THz cameras going significantly beyond the limitations of conventional Silicon CMOS technology.
