Terahertz-Light Field Camera Prototyp
Light-field cameras record both the brightness and direction of the incident light rays. This spatiodirectional information can be post-processed for a dynamic focal point adjustment and 3-D imaging. Light-field has traditionally been a domain of visible light computational imaging. Our chair is leading the development of light-field methodologies for the THz spectrum, bringing new foundational understanding and hardware capabilities for bridging the terahertz gap.
Currently, we are building the first ever THz light-field camera prototype - which consists of a 3x3 super-array of lens coupled 1k-pixel THz CMOS cameras - in a single package. The CMOS camera chip is presented in the International Solid-State Circuits Conference (ISSCC) 2021. The figure shows the prototype of the light field array. The prototype serves as the hardware platform for the development of light-field based real-time THz 3-D imaging techniques.
Preliminary work:
- 2014
1725.
Hoffmann, Max; Kreisköther, Kai; Büscher, Christian; Meisen, Tobias; Kampker, Achim; Schilberg, Daniel; Jeschke, Sabina
Optimized Factory Planning and Process Chain Formation Using Virtual Production Intelligence
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 153—158
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141724.
Hoffmann, Max; Kreisköther, Kai; Büscher, Christian; Meisen, Tobias; Kampker, Achim; Schilberg, Daniel; Jeschke, Sabina
Optimized Factory Planning and Process Chain Formation Using Virtual Production Intelligence
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 153—158
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141723.
Hoffmann, Max; Kreisköther, Kai; Büscher, Christian; Meisen, Tobias; Kampker, Achim; Schilberg, Daniel; Jeschke, Sabina
Optimized Factory Planning and Process Chain Formation Using Virtual Production Intelligence
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 153—158
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141722.
Hoffmann, Max; Kreisköther, Kai; Büscher, Christian; Meisen, Tobias; Kampker, Achim; Schilberg, Daniel; Jeschke, Sabina
Optimized Factory Planning and Process Chain Formation Using Virtual Production Intelligence
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 153—158
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141721.
Logvinenko, Alexander; Tutsch, Dietmar
Performance Evaluation of Reconfiguration Algorithms for the Reconfigurable Network on Chip Architecture RecMIN
Proceedings of the Sixth International Conference on Adaptive and Self-Adaptive Systems and Applications (ADAPTIVE 2014), Venedig, Italien, Page 85--91
Publisher: IARIA
20141720.
Logvinenko, Alexander; Tutsch, Dietmar
Performance Evaluation of Reconfiguration Algorithms for the Reconfigurable Network on Chip Architecture RecMIN
Proceedings of the Sixth International Conference on Adaptive and Self-Adaptive Systems and Applications (ADAPTIVE 2014), Venedig, Italien, Page 85--91
Publisher: IARIA
20141719.
Logvinenko, Alexander; Tutsch, Dietmar
Performance Evaluation of Reconfiguration Algorithms for the Reconfigurable Network on Chip Architecture RecMIN
Proceedings of the Sixth International Conference on Adaptive and Self-Adaptive Systems and Applications (ADAPTIVE 2014), Venedig, Italien, Page 85--91
Publisher: IARIA
20141718.
Kasolis, F.; Wadbro, E.; Berggren, M.
Preventing resonances in approximated sound-hard material in topology optimization of acoustic devices
Proceedings of the first international conference on engineering and applied sciences optimization (OPT-i), ISBN: 978-960- 99994-5-8
20141717.
Proceedings of the International Conference on Computer Information Systems (ICCIS 2014); Hammamet, Tunesien
Publisher: IEEE
20141716.
Proceedings of the Sixth International Conference on Adaptive and Self-Adaptive Systems and Applications (ADAPTIVE 2014), Venedig, Italien
Publisher: IARIA
20141715.
Heinemann, Anna; Gavriilidis, Alexandros; Sablik, Thomas; Stahlschmidt, Carsten; Velten, Jörg; Kummert, Anton
RSSI-Based Real-Time Indoor Positioning Using ZigBee Technology for Security Applications
In Dziech, A. and Czcyzewski, Andrzej, Editor, 7th International Conference, MCSS 2014, Krakow, Poland, June 11-12, 2014. ProceedingsVolume429fromMultimedia Communications, Services and Security, Page pp 83-95
In Dziech, A. and Czcyzewski, Andrzej, Editor
Publisher: Springer International Publishing
2014ISBN: 978-3-319-07568-6
1714.
Heredia Conde, M.; Hartmann, K.; Loffeld, O.
Subpixel Spatial Response of PMD Pixels
In Imaging Systems and Techniques (IST), 2014 IEEE International Conference on, Page p.297 - 302
20141713.
Reinhard, Rudolf; Al-Khawli, Toufik; Eppelt, Urs; Meisen, Tobias; Schilberg, Daniel; Schulz, Wolfgang; Jeschke, Sabina
The Contribution of Virtual Production Intelligence to Laser Cutting Planning Processes
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 117—123
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141712.
Reinhard, Rudolf; Al-Khawli, Toufik; Eppelt, Urs; Meisen, Tobias; Schilberg, Daniel; Schulz, Wolfgang; Jeschke, Sabina
The Contribution of Virtual Production Intelligence to Laser Cutting Planning Processes
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 117—123
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141711.
Reinhard, Rudolf; Al-Khawli, Toufik; Eppelt, Urs; Meisen, Tobias; Schilberg, Daniel; Schulz, Wolfgang; Jeschke, Sabina
The Contribution of Virtual Production Intelligence to Laser Cutting Planning Processes
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 117—123
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141710.
Reinhard, Rudolf; Al-Khawli, Toufik; Eppelt, Urs; Meisen, Tobias; Schilberg, Daniel; Schulz, Wolfgang; Jeschke, Sabina
The Contribution of Virtual Production Intelligence to Laser Cutting Planning Processes
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 117—123
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141709.
Reinhard, Rudolf; Al-Khawli, Toufik; Eppelt, Urs; Meisen, Tobias; Schilberg, Daniel; Schulz, Wolfgang; Jeschke, Sabina
The Contribution of Virtual Production Intelligence to Laser Cutting Planning Processes
In Zaeh, Michael F., Editor, Enabling Manufacturing Competitiveness and Economic Sustainability, Page 117—123
In Zaeh, Michael F., Editor
Publisher: Springer, Cham
20141708.
Heredia Conde, M.; Hartmann, K.; Loffeld, O.
Turning a ToF camera into an illumination tester: Multichannel waveform recovery from few measurements using compressed sensing
3D Imaging (IC3D), 2014 International Conference on, Page p.1 - 8
20141707.
Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf
Virtuelle Produktion – Die Virtual Production Intelligence im Einsatz
Exploring Virtuality :93—110
20141706.
Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf
Virtuelle Produktion — Die Virtual Production Intelligence im Einsatz
Exploring Virtuality :93—110
20141705.
Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf
Virtuelle Produktion — Die Virtual Production Intelligence im Einsatz
Exploring Virtuality :93—110
20141704.
Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf
Virtuelle Produktion — Die Virtual Production Intelligence im Einsatz
Exploring Virtuality :93—110
20141703.
Schilberg, Daniel; Meisen, Tobias; Reinhard, Rudolf
Virtuelle Produktion — Die Virtual Production Intelligence im Einsatz
Exploring Virtuality :93—110
20141702.
Wang, Ying; Ewert, Daniel; Meisen, Tobias; Schilberg, Daniel; Jeschke, Sabina
Working Area Monitoring in Dynamic Environments Using Multiple Auto-aligning 3-D Sensor
Journal of Sensors and Sensor Systems, 3 :113—120
20141701.
Wang, Ying; Ewert, Daniel; Meisen, Tobias; Schilberg, Daniel; Jeschke, Sabina
Working Area Monitoring in Dynamic Environments Using Multiple Auto-aligning 3-D Sensor
Journal of Sensors and Sensor Systems, 3 :113—120
2014
